在大规模红外读出电路中,接口电路的数据传输效率及接口数量尤为关键.传统接口电路采用并行接口进行数据传输,这种方式会占用较多的芯片引脚.为了提升数据的传输效率,设计了一款用于数据接收的3通道串行低压差分信号(Low V oltage Differential Signaling,LVDS)接口电路.电路采用 0.18 μm互补金属氧化物半导体(Complementary Metal Oxide Semiconductor,CMOS)工艺设计.仿真结果表明,LVDS接口电路在400 MHz频率下,能够将2路接收端数据转换为8路数据并将其输出给内部数字处理单元.与传统并行接口相比,本电路节省了 6个数据传输引脚,大大提高了数据传输效率.
Design of LVDS Receiver Circuit Used in Infrared ROIC
In large-scale infrared readout integrated circuits(ROIC),the data transfer efficiency and the num-ber of interface circuits are particularly crucial.Traditional interface circuits use parallel interfaces for data transmission,which takes up a significant amount of chip pins.In order to improve the efficiency of data transmission,a 3-channel serial low voltage differential signaling(LVDS)interface circuit is designed for data reception.The circuit adopts a 0.18 μm complementary metal oxide semiconductor(CMOS)process.The simulation results show that the LVDS interface circuit can convert 2-channel receiver data into 8-channel data at a frequency of 400 MHz and output it to the internal digital processing unit.Compared with traditional par-allel interfaces,this circuit saves 6 data transmission pins,greatly improving data transmission efficiency.
low voltage differential signalLVDSinfrared ROICserial-to-parallel
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