化学反应工程与工艺2024,Vol.40Issue(4) :314-323.DOI:10.11730/j.issn.1001-7631.2024.04.0314.10

共聚型聚酰亚胺树脂的成型工艺与性能研究

Study on Molding Process and Properties of Copolymerized Polyimide Resin

刘京妮 崔晶 张培斌 姜天 孙旭阳
化学反应工程与工艺2024,Vol.40Issue(4) :314-323.DOI:10.11730/j.issn.1001-7631.2024.04.0314.10

共聚型聚酰亚胺树脂的成型工艺与性能研究

Study on Molding Process and Properties of Copolymerized Polyimide Resin

刘京妮 1崔晶 1张培斌 1姜天 1孙旭阳1
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作者信息

  • 1. 中石化(上海)石油化工研究院有限公司,上海 201208
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摘要

为改善热固性聚酰亚胺树脂的加工性,对聚酰亚胺树脂进行共聚改性,制备易于加工、热性能优异的聚酰亚胺树脂,并对其反应机理、固化动力学和成型工艺进行研究.通过红外测试和核磁 13C 谱图分析树脂在热处理过程中的组成变化,得到该树脂粉末的最佳干燥温度为250℃;建立固化动力学方程,并得到不同温度条件下固化程度随时间的变化趋势,即在340℃保温100 min后固化达到 100%.流变测试得到树脂最低熔体黏度为52.1 Pa∙s,凝胶点在310℃保温28 min处,给真空排气等工艺保留充足的操作时间,加工窗口较宽.通过综合特性的表征分析,确定了树脂成型工艺,制备的共聚型聚酰亚胺树脂具有较好的加工性和热性能,玻璃化转变温度达到370℃.

Abstract

To improve the processability of thermosetting polyimide resin,a modified polyimide resin with excellent thermal properties was synthesized through copolymerization.The reaction mechanism,curing kinetics,and molding process of the resin were studied.The composition changes of the resin during heat treatment were analyzed by Fourier infrared spectroscopy(FT-IR)and 13C nuclear magnetic resonance(13C-NMR)spectrum,and the optimum drying temperature of the resin powder was determined to be 250℃.The curing kinetics equation was established,and the changing trend of curing degree with time under different temperature conditions was obtained,the curing degree reached 100%after 100 min at 340℃.The processing window was wide,the lowest melt viscosity of the resin was 52.1 Pa∙s,and the gel transformation occurred at 28 min under the temperature of 310℃,allowing sufficient operating time for exhaust processes.The molding process of PI resin was determined based on comprehensive characterization,and the copolymerized polyimide resin obtained exhibited good processability and thermal properties,with a glass transition temperature of 370℃.

关键词

聚酰亚胺/树脂/固化/动力学/成型工艺

Key words

polyimide/resin/curing/kinetics/molding process

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出版年

2024
化学反应工程与工艺
联合化学反应工程研究所 ,中石化上海石油化工研究院

化学反应工程与工艺

CSTPCD
影响因子:0.392
ISSN:1001-7631
参考文献量9
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