Preparation and application of epoxy resin plug hole ink for printed circuit board with high thickness-diameter ratio
In order to achieve high aspect ratio of printed circuit board(PCB)resin plug hole and ensure the performance of the ink at the same time,this paper uses epoxy resin as the matrix,modified micron/nano SiO2 as the filler,with curing agent methyl hexa-hydrophthalic anhydride and other additives under certain process conditions to make plug hole ink.The curing process parameters of ink were determined by differential scanning calorimetry(DSC).Infrared spectroscopy(FT-IR)was used to characterize the SiO2 before and after modification.Through thermal expansion test(CTE),tensile strength test and resin plug hole test,the influence of different particle size filler addition ratio on ink performance was studied,and the optimal formula of ink was determined.The results show that the thermal expansion coefficient and tensile strength of W/N70-30 ink prepared in this experiment are better than those of PHP-3F-DS and PHP-900 ink products.After plugging the hole,it was found that the back of the through-holes with 0.13 mm and 0.15 mm apertures on the 5 mm PCB board showed oil phenomenon,and the plugging effect was the best.Therefore,the W/N70-30 ink prepared in this experiment can be applied to high thickness ratio(40∶1)printed circuit boards.
silicon dioxideepoxy resin inkcoefficient of thermal expansiontensile strengthresin plug hole
万方数据
维普
