To meet the requirements of silicon wafer for multi-wire saw, a fully automatic machine thread tension control method was presented according to the features of alignment system of multi-wire saw. This method was applied to ensure cutting line constant tension. Then automatic machine thread tension control system was simulated. Simulation results show that this method can meet the processing requirements of die large-diameter and ultra-thin silicon wafer.
NETL
NSTL
万方数据
维普
