首页|2D multifunctional devices:from material preparation to device fabrication and neuromorphic applications

2D multifunctional devices:from material preparation to device fabrication and neuromorphic applications

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Neuromorphic computing systems,which mimic the operation of neurons and synapses in the human brain,are seen as an appealing next-generation computing method due to their strong and efficient computing abilities.Two-dimensional(2D)materials with dangling bond-free surfaces and atomic-level thicknesses have emerged as promising candidates for neuromorphic computing hardware.As a result,2D neuromorphic devices may provide an ideal platform for developing multifunctional neuromorphic applications.Here,we review the recent neuromorphic devices based on 2D material and their multifunctional applications.The synthesis and next micro-nano fabrication methods of 2D materials and their heterostructures are first introduced.The recent advances of neuromorphic 2D devices are discussed in detail using different operating principles.More importantly,we present a review of emerging multifunctional neuromorphic applications,including neuromorphic visual,auditory,tactile,and nociceptive systems based on 2D devices.In the end,we discuss the problems and methods for 2D neuromorphic device developments in the future.This paper will give insights into designing 2D neuromorphic devices and applying them to the future neuromorphic systems.

2D materialmicro-nano fabricationmultifunctional systemneuromorphic electronicsartificial intelligence

Zhuohui Huang、Yanran Li、Yi Zhang、Jiewei Chen、Jun He、Jie Jiang

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Hunan Key Laboratory of Nanophotonics and Devices,School of Physics,Central South University,Changsha,Hunan,People's Republic of China

Department of Applied Physics,The Hong Kong Polytechnic University,Hong Kong Special Administrative Region of China,People's Republic of China

Hunan Science Fund for Distinguished Young ScholarsNational Natural Science Foundation of China

2023JJ1006952172169

2024

极端制造(英文)

极端制造(英文)

CSTPCDEI
ISSN:
年,卷(期):2024.6(3)
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