Novel fabrication techniques for ultra-thin silicon based flexible electronics

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外文摘要：Flexible electronics offer a multitude of advantages,such as flexibility,lightweight property,portability,and high durability.These unique properties allow for seamless applications to curved and soft surfaces,leading to extensive utilization across a wide range of fields in consumer electronics.These applications,for example,span integrated circuits,solar cells,batteries,wearable devices,bio-implants,soft robotics,and biomimetic applications.Recently,flexible electronic devices have been developed using a variety of materials such as organic,carbon-based,and inorganic semiconducting materials.Silicon(Si)owing to its mature fabrication process,excellent electrical,optical,thermal properties,and cost efficiency,remains a compelling material choice for flexible electronics.Consequently,the research on ultra-thin Si in the context of flexible electronics is studied rigorously nowadays.The thinning of Si is crucially important for flexible electronics as it reduces its bending stiffness and the resultant bending strain,thereby enhancing flexibility while preserving its exceptional properties.This review provides a comprehensive overview of the recent efforts in the fabrication techniques for forming ultra-thin Si using top-down and bottom-up approaches and explores their utilization in flexible electronics and their applications.

外文关键词：

flexible electronicssilicon fabrication techniquetop-down approachbottom-up approach

作者：

Ju Young Lee、Jeong Eun Ju、Chanwoo Lee、Sang Min Won、Ki Jun Yu

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作者单位：

School of Electrical and Electronic Engineering,Yonsei University,50 Yonsei-ro,Seodaemungu,Seoul 03722,Republic of Korea

Department of Electrical and Computer Engineering,Sungkyunkwan University,Suwon 16419,Republic of Korea

YU-Korea Institute of Science and Technology(KIST)Institute,Yonsei University,50,Yonsei-ro,Seodaemun-gu,Seoul 03722,Republic of Korea

基金：

National Research Foundation of Korea(NRF)grant funded by the Korea government(MSIT)Yonsei FellowshipKIST Institutional ProgramNational Research Foundation of Korea(NRF)grant funded by the Korea governmentNational Research Foundation of Korea(NRF)grant funded by the Korea governmentNational Research Foundation of Korea(NRF)grant funded by the Korea government

项目编号：

RS-2024-003537682E31603-22-140NRF-2021R1C1C1009410NRF-2022R1A4A3032913RS-2024-00411904

出版年：

2024

DOI：

10.1088/2631-7990/ad492e

极端制造(英文)

CSTPCDEI

ISSN：

年,卷(期)：2024.6(4)