首页|鳞片铜粉对装备电子部件损伤实验研究

鳞片铜粉对装备电子部件损伤实验研究

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鳞片铜粉是干扰弹所装填干扰剂的主要成分之一,干扰弹爆炸后形成的烟幕颗粒具有较好的导电性,且粒径较小,极易在装备运动过程中受到振动进一步嵌入电子部件的各引脚缝隙.当导电颗粒堆积形成一定厚度导电片层时,将导致电子部件发生短路故障,使得装备受损.针对此问题,设计损伤实验,采用示波器检测计算机主板启动时BIOS芯片电信号,验证鳞片铜粉对计算机主板的损伤情况.结果表明,累计布洒6.0 g鳞片铜粉并振动 60 s会造成计算机主板损伤,对比分析振动因素对损伤的影响,对鳞片铜粉损伤电子部件情况进行分析,评估了干扰弹使用后造成装备电子部件损伤的情况,验证了鳞片铜粉会对装备电子部件造成严重危害,为烟幕干扰剂的发展明确了方向.
Experimental Verification of Damage of Scale Copper Powder to Equipment Electronic Components
The scale copper powder is one of the main components of the jamming agent in the jamming projectile.With good electrical conductivity and small size,the smoke screen particles formed after the ex-plosion of the jamming projectile are easy to enter the interior of the equipment through gaps.During the equipment movement,the smoke screen particles are further embedded into the pin gaps of the electronic components by vibration.This will cause short circuit failure of electronic components and do damage to the equipment.To solve this problem,a damage experiment is designed,and an oscilloscope is used to de-tect the electrical signal of the BIOS chip when the computer motherboard is started,in order to verify the damage of the scale copper powder to the computer motherboard.The results show that the computer motherboard is damaged by spreading 6.0 g of scale copper powder and vibrating for 60 s.The influences of the vibration factors on the damage is compared and analyzed,and the damage of electronic components caused by scale copper powder is analyzed.The damage of equipment electronic components caused by the explosion of jamming shells is evaluated,and it is verified that the scale copper powder will cause serious harm to equipment electronic components.The development direction of smoke-screen jamming agent is clarified.

smoke screenscale copper powderjamming agentshort-circuit faultelectronic com-ponentequipment damage

管智超、高欣宝、李天鹏、李笑楠、郭爱强

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陆军工程大学 石家庄校区,河北 石家庄 050000

63936 部队,北京 102202

烟幕 鳞片铜粉 干扰剂 短路故障 电子部件 装备损伤

2024

陆军工程大学学报
解放军理工大学科研部

陆军工程大学学报

影响因子:0.556
ISSN:2097-0730
年,卷(期):2024.3(1)
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