首页|磁流变超精密加工硅晶圆片的力学特性及其质量控制

磁流变超精密加工硅晶圆片的力学特性及其质量控制

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晶圆是一种超薄且具有硬脆性的高精度光学材料,传统加工难度较大且具有一定的局限性,高集成度的集成电路发展对硅晶圆片表面的线宽、硅晶片的平直度要求越来越苛刻.磁流变超精密加工技术作为柔性加工手段通过调控磁场的变化规律,进而控制磁流变抛光液的流变特性,实现晶圆表面材料去除和表面误差校正.为揭示磁流变超精密加工晶圆表面质量控制规律,基于晶圆材料的JH2本构模型,对磁流变超精密加工过程中的表面应力、表面压力及切削方向规律残余压力进行探讨,获得磁流变超精密加工晶圆的力学特性,形成磁流变超精密加工硅晶圆片的质量控制.
Mechanical properties and quality control of magnetorheological ultra precision machining with silicon crystal wafers
Wafer is a high-precision optical material with ultra-thin and hard brittleness,and traditional processing is difficult and has certain limitations.The development of high integration integrated circuits has increasingly stringent requirements for the surface linewidth and flatness of silicon wafers.As a flexible processing method,magnetorheological ultra precision machining technology controls the rheological properties of magnetorheological polishing fluid by regulating the variation of magnetic field,achieving material removal and surface error correction on wafer surface.To reveal the quality control law of magnetorheological ultra-precision machining wafer surface,based on the JH2 constitutive model of wafer material,this paper discusses the surface stress,surface pressure,and cutting direction residual pressure in the process of magnetorheological ultra-precision machining,obtains the mechanical properties of magnetorheological ultra-precision machining wafer,and forms the quality control of magnetorheological ultra-precision machining silicon wafer.

magnetorheologicalultra precision machiningwaferquality control

李俊烨、曹欣锐、汤家旭、朱金宝

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长春理工大学 机电工程学院,吉林 长春 130022

磁流变 超精密加工 晶圆 质量控制

吉林省教育厅科学技术研究项目重庆市自然科学基金项目

JJKH20220734KJCSTB2022NSCQ-MSX0602

2024

长春工业大学学报
长春工业大学

长春工业大学学报

影响因子:0.282
ISSN:1674-1374
年,卷(期):2024.45(4)
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