Wafer is a high-precision optical material with ultra-thin and hard brittleness,and traditional processing is difficult and has certain limitations.The development of high integration integrated circuits has increasingly stringent requirements for the surface linewidth and flatness of silicon wafers.As a flexible processing method,magnetorheological ultra precision machining technology controls the rheological properties of magnetorheological polishing fluid by regulating the variation of magnetic field,achieving material removal and surface error correction on wafer surface.To reveal the quality control law of magnetorheological ultra-precision machining wafer surface,based on the JH2 constitutive model of wafer material,this paper discusses the surface stress,surface pressure,and cutting direction residual pressure in the process of magnetorheological ultra-precision machining,obtains the mechanical properties of magnetorheological ultra-precision machining wafer,and forms the quality control of magnetorheological ultra-precision machining silicon wafer.
关键词
磁流变/超精密加工/晶圆/质量控制
Key words
magnetorheological/ultra precision machining/wafer/quality control
维普
万方数据