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Al-Si-Mg-B-Sr合金的均匀化退火工艺

Homogenization annealing process of Al-Si-Mg-B-Sr alloy

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对铸态Al-Si-Mg-B-Sr合金进行了不同温度和不同保温时间的均匀化退火处理,采用显微组织观察、硬度测试、导电率测试等手段研究了不同均匀化退火工艺对Al-Si-Mg-B-Sr合金组织、硬度与导电率的影响.结果表明,铸态合金组织存在一定偏析现象.经过550 ℃ ×9 h均匀化退火的合金组织均匀,偏析基本消除.随着均匀化退火时间的延长,合金的硬度先升高后降低,导电率逐渐升高.550 ℃ ×9 h均匀化退火的Al-Si-Mg-B-Sr合金的硬度最高,为74.5 HV0.5;550℃× 15 h均匀化退火的合金的导电率最高,达到 55.9%IACS.
As-cast Al-Si-Mg-B-Sr alloy was homogenization annealed under different temperatures and holding time.The effects of different homogenization annealing processes on microstructure,hardness and conductivity of the Al-Si-Mg-B-Sr alloy were studied by means of microstructure observation,hardness test and conductivity test.The results show that the microstructure of as-cast alloy has certain segregation phenomenon.After homogenization annealing at 550 ℃ for 9 h,the microstructure of the alloy is uniform and the segregation is basically eliminated.With the extension of homogenization annealing time,the hardness of the alloy increases first and then decreases,and the conductivity gradually increases.The hardness of the Al-Si-Mg-B-Sr alloy homogenization annealed at 550 ℃ for 9 h is the highest,which is 74.5 HV0.5.The conductivity of the alloy homogenization annealed at 550 ℃ for 15 h is the maximum,reaching 55.9%IACS.

Al-Si-Mg-B-Sr alloyhomogenization annealingmicrostructurehardnessconductivity

李东阳、李艳霞

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北华航天工业学院机电工程学院,河北廊坊 065000

北华航天工业学院材料工程学院,河北廊坊 065000

Al-Si-Mg-B-Sr合金 均匀化退火 显微组织 硬度 导电率

河北省高等学校科学技术研究项目

QN2016206

2024

金属热处理
北京机电研究所 中国机械工程学会热处理学会 中国热处理行业协会

金属热处理

CSTPCD北大核心
影响因子:0.546
ISSN:0254-6051
年,卷(期):2024.49(2)
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