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热处理工艺和铜含量对高硅无取向硅钢织构的影响

Effect of heat treatment process and copper content on texture of high-silicon non-oriented silicon steel

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采用背散射电子衍射技术(EBSD)对无Cu与含Cu高硅无取向硅钢热处理过程的织构进行了检测,分析了微量Cu元素对高硅无取向硅钢织构的影响,并对其微观机理进行了探究.结果表明,在1000℃高温再结晶退火时,添加微量Cu元素对硅钢成品的织构起到明显的恶化作用;高温退火工艺可以更充分发挥剪切带优化织构的作用,但含微量Cu元素的无取向硅钢对剪切带优化织构有明显的抑制作用,其原因与基体中弥散析出的含Cu析出相有关.
Effect of copper content on the texture of two high-silicon non-oriented silicon steels without Cu and with trace Cu was analyzed by EBSD technology,and the microscopic mechanism was also investigated.The results indicate that after high temperature annealing at 1000 ℃,the addition of trace Cu element has an obvious harmful effect on the texture of finished silicon steel product.The high temperature annealing process plays a more full role in optimizing the texture by the shear bands,while such optimizing effect is inhibited obviously by adding of trace Cu to the non-oriented silicon steel,which is attributed to the dispersive distribution of the copper precipitates in the steel matrix.

copper precipitatesnon-oriented silicon steeltextureshear bandheat treatment

薛润东、方锡祯

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北京科技大学新材料研究院,北京 100083

北京科技大学材料科学与工程学院,北京 100083

含Cu析出相 无取向硅钢 织构 剪切带 热处理

江西省中央引导地方科技发展资金项目

2022ZDD03079

2024

金属热处理
北京机电研究所 中国机械工程学会热处理学会 中国热处理行业协会

金属热处理

CSTPCD北大核心
影响因子:0.546
ISSN:0254-6051
年,卷(期):2024.49(4)
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