热处理工艺和铜含量对高硅无取向硅钢织构的影响
Effect of heat treatment process and copper content on texture of high-silicon non-oriented silicon steel
薛润东 1方锡祯2
作者信息
- 1. 北京科技大学新材料研究院,北京 100083
- 2. 北京科技大学材料科学与工程学院,北京 100083
- 折叠
摘要
采用背散射电子衍射技术(EBSD)对无Cu与含Cu高硅无取向硅钢热处理过程的织构进行了检测,分析了微量Cu元素对高硅无取向硅钢织构的影响,并对其微观机理进行了探究.结果表明,在1000℃高温再结晶退火时,添加微量Cu元素对硅钢成品的织构起到明显的恶化作用;高温退火工艺可以更充分发挥剪切带优化织构的作用,但含微量Cu元素的无取向硅钢对剪切带优化织构有明显的抑制作用,其原因与基体中弥散析出的含Cu析出相有关.
Abstract
Effect of copper content on the texture of two high-silicon non-oriented silicon steels without Cu and with trace Cu was analyzed by EBSD technology,and the microscopic mechanism was also investigated.The results indicate that after high temperature annealing at 1000 ℃,the addition of trace Cu element has an obvious harmful effect on the texture of finished silicon steel product.The high temperature annealing process plays a more full role in optimizing the texture by the shear bands,while such optimizing effect is inhibited obviously by adding of trace Cu to the non-oriented silicon steel,which is attributed to the dispersive distribution of the copper precipitates in the steel matrix.
关键词
含Cu析出相/无取向硅钢/织构/剪切带/热处理Key words
copper precipitates/non-oriented silicon steel/texture/shear band/heat treatment引用本文复制引用
基金项目
江西省中央引导地方科技发展资金项目(2022ZDD03079)
出版年
2024
NETL
NSTL
万方数据