冷拉拔铜线强度和微观组织的演化机制定量研究
Quantitative study on evolution mechanisms of strength and microstructure of cold drawn Cu wire
范雪圆 1王硕 2顾建 3张振军 2李冬青 3刘增乾 1侯嘉鹏 2张哲峰1
作者信息
- 1. 郑州大学河南先进技术研究院,河南郑州 450001;中国科学院金属研究所沈阳材料科学国家实验室,辽宁沈阳 110016
- 2. 中国科学院金属研究所沈阳材料科学国家实验室,辽宁沈阳 110016
- 3. 中国电力科学研究院有限公司,北京 102401
- 折叠
摘要
通过冷拉拔制备了 3种不同应变量的铜线,研究了铜线强度和微观组织与应变量的关系.结果表明,冷拔过程中铜线强度呈现出前期增长较快、后期增长缓慢的变化趋势.微观表征发现,冷拔过程中铜线晶粒宽度不断减小,晶粒取向逐渐从<001>向<111>转动,最终形成了高比例的<111>织构,位错密度呈现先增大再下降的规律.进一步建立的微观组织与强度的定量关系发现,晶界强化和位错强化是拉拔初期铜线强度大幅增加的根本原因;而变形后期晶界强化和织构强化的增加以及位错强化的显著下降是拉拔后期铜线强度增加缓慢的主要机制.
Abstract
Three types of Cu wires with different deformation strains were prepared by the cold drawing process.The relationship between the strength,microstructure and strains of the Cu wires was studied.The results show that during the cold drawing process,the strength of the Cu wire shows a trend of rapid increase in the early drawing stage and slow increase in the later drawing stage.Microstructure observations reveal that the grain width of the Cu wire decreases continuously,and the grain orientation gradually rotates from<001>to<111>,forming a high proportion of<111>texture.Additionally,the dislocation density first increases and then decreases with the increase of drawing strains.Further established quantitative relationship between the microstructure and the strength reveals that the grain boundary strengthening and dislocation strengthening are the fundamental reasons for the significant increase in strength of Cu wires during the initial drawing stage.While,the main mechanism for the slow increase in strength of Cu wires in the later stage of drawing is the increase in fine grain strengthening and texture strengthening,as well as the significant decrease in dislocation strengthening.
关键词
纯铜线/冷拉拔/强度/微观组织Key words
pure Cu wire/cold drawing/strength/microstructure引用本文复制引用
基金项目
国家电网浙江省电力公司项目(5211HD190002)
出版年
2024
NETL
NSTL
万方数据