首页|TC4钛合金与增材制造17-4PH不锈钢扩散焊界面微观组织及工艺参数的影响

TC4钛合金与增材制造17-4PH不锈钢扩散焊界面微观组织及工艺参数的影响

Interfacial microstructure of diffusion bonded joints of TC4 titanium alloy and additive manufactured 17-4 PH stainless steel and effect of process parameters

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针对TC4钛合金和原子扩散增材制造(ADAM)17-4PH不锈钢,采用不同中间层及不同温度进行扩散焊连接,通过光学显微镜、扫描电镜、能谱分析及显微硬度测试等手段对接头界面的微观组织特征及性能进行了研究.结果表明,采用Cu箔+Ni箔复合中间层,扩散焊温度960、920 ℃,保温时间60 min,焊接压力2 MPa,均获得成形良好的TC4钛合金/ADAM 17-4PH不锈钢扩散焊接头,界面区域主要包含4个不同的区域,依次为TC4钛合金侧的扩散影响区(DAZ 1)、中间层Cu箔+Ni箔发生扩散反应生成界面反应区(IRZ 1与IRZ2)、ADAM 17-4PH不锈钢侧的扩散影响区(DAZ 2).扩散焊温度为960 ℃时,界面IRZ 2中生成了 CuTi+CuTi2共晶相及CuTi2、Ti(Cu,Ni)、α-Ti相,剪接强度最大,为163 MPa.采用Cu箔+Ni箔时,扩散焊温度由920 ℃升高至960℃,界面区宽度从243.5μm增长为278.2 μm,IRZ 2区域显微硬度峰值从693 HV0.1降至612 HV0.1.当扩散焊温度(960 ℃)不变,中间层为Cu箔+Ni箔的扩散焊接头显微硬度峰值最高,约为612 HV0.1.中间层为Ni箔的显微硬度峰值最低,在IRZ区域,约为495 HV0.1.
TC4 titanium alloy and atomic diffusion additive manufactured(ADAM)17-4PH(stainless steel were diffusion bonded with different interlayers at different temperatures.The microstructure characteristics and properties of the joint interface were analyzed by means of optical microscope,scanning electron microscope,EDS analysis and microhardness testing.The results show that a well formed TC4 titanium alloy/ADAM 17-4PH stainless steel diffusion bonded joint is obtained by using a Cu foil+Ni foil composite interlayer at 960 ℃ and 920℃,with holding time of 60 min and welding pressure of 2 MPa.The interfacial area mainly includes four different zones,namely the diffusion affected zone on the TC4 titanium alloy side(DAZ 1),the interface reaction zone(IRZ 1 and IRZ 2)generated by the diffusion reaction of Cu foil+Ni foil and the diffusion affected zone on the ADAM 17-4PH stainless steel side(DAZ 2).When the diffusion bonding temperature is 960 ℃,CuTi+CuTi2 eutectic phase and CuTi2,Ti(Cu,Ni),α-Ti phases are generated in the IRZ 2,with the highest shearing strength of 163 MPa.With the diffusion bonding temperature increases from 920 ℃ to 960 ℃,the width of interface increases from 243.5 μm to 278.2 μm and the maximum microhardness of IRZ 2 decreases from 693 HV0.1 to 612 HV0.1 in the case of Cu foil+Ni foil as interlayers.When the diffusion bonding temperature remains constant(960 ℃),the peak microhardness of the diffusion bonded joint with Cu foil+Ni foil as interlayers is the highest,about 612 HV0.1,while that with Ni foil as interlayer is the lowest,approximately 495 HV0.1,in the IRZ.

atomic diffusion additive manufacturing17-4PH stainless steelTC4 titanium alloydiffusion bondinginterfacial microstructure

王理想、刘坤、李洁、芦笙、许聪、陈东俊

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江苏科技大学材料科学与工程学院,江苏镇江 212100

舍弗勒贸易(上海)有限公司,上海 201804

原子扩散增材制造 17-4PH不锈钢 TC4钛合金 扩散焊 界面组织

2024

金属热处理
北京机电研究所 中国机械工程学会热处理学会 中国热处理行业协会

金属热处理

CSTPCD北大核心
影响因子:0.546
ISSN:0254-6051
年,卷(期):2024.49(11)