Thermal Design and Analysis of Key Electronic Components of a Solid State Laser
The concentrated distribution of key electronic devices such as solid state laser seed source will cause large heating power,and the operating temperature of components can rise up as high as 120℃,resulting in damage to components and failure of the prototype to work normally.In order to solve this problem,this paper proposes a heat dissipation scheme for the thermal design of key electronic components.Specifically,a heat dissipation mode is adopted with combination of a heat sink and forced air cooling mode.The layout of natural heat dissipation and forced air cooling of key electronic components is optimized.ICEPAK parametric assisted calculation is used to design the heat sink structure and the model of fan is selected.After the optimization design,the thermal simulation of the key electronic components is carried out in the natural environment.The simulation results show that the maximum temperature of the components can be effectively reduced to 31℃by using the combination of the heat sink and forced air cooling method,which meets the operating requirements of the components.After the prototype is developed,relevant tests are carried out and all have passed.
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