首页|碳化硅复合陶瓷密封材料的烧结性能、显微结构与力学性能

碳化硅复合陶瓷密封材料的烧结性能、显微结构与力学性能

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以纳米TiN、SiC晶须为增强相,采用液相烧结法制备了碳化硅复合陶瓷密封材料,研究了不同烧结温度(1 800,1 850,1 900,1 950 ℃),不同增强相添加质量分数(0,2。5%,5。0%,10。0%,纳米TiN与SiC晶须质量比为1∶1)下复合陶瓷的烧结性能、显微组织和力学性能。结果表明:随烧结温度升高,陶瓷硬度和抗弯强度均先增大后减小,断裂韧度先减小后增大,当烧结温度为1 900 ℃时,碳化硅复合陶瓷烧结完全,相对密度较高,晶粒平均尺寸较小;在1 900 ℃下烧结,与未添加增强相相比,添加增强相碳化硅复合陶瓷的晶粒尺寸减小,晶粒结构排列紧密;随着增强相添加量增加,陶瓷硬度下降,抗弯强度先增大后减小,断裂韧度明显增大;当烧结温度为1 900 ℃,增强相质量分数为5。0%时,碳化硅复合陶瓷具有最佳综合性能,相对密度为94。68%,抗弯强度为429。51 MPa,硬度为 17。14 GPa,断裂韧度为 4。32 MPa·m1/2。
Sintering Properties,Microstructure and Mechanical Properties of Silicon Carbide Composite Ceramic Sealing Material
With Nano-TiN and SiC whisker as reinforcement phase,the silicon carbide composite ceramic sealing material was prepared by liquid phase sintering.At different sintering temperatures(1 800,1 850,1 900,1 950 ℃),the sintering properties,microstructure and mechanical properties of the composite ceramics with different mass fractions(0,2.5%,5.0%,10.0%,the mass ratio of Nano-TiN to SiC whisker was 1∶1)of reinforcement phase were studied.The results with the increase of sintering temperature,the hardness and bending strength of ceramics first increased and then decreased,the fracture toughness first decreased and then increased.When the sintering temperature was 1 900 ℃,the silicon carbide composite ceramics were completely sintered,the relative density was higher,and the average grain size was smaller.When sintered at 1 900 ℃,the grain size of silicon carbide composite ceramic sealing material with reinforcement phase decreased and the grain structure was closely arranged compared with those without reinforcement phase.When the sintering temperature was 1 900 ℃ and the mass fraction of the reinforcement phase was 5.0%,the silicon carbide composite ceramics had the best comprehensive properties with relative density of 94.68%,bending strength of 429.51 MPa,hardness of 17.14 GPa,fracture toughness of 4.32 MPa·m1/2.

silicon carbidecomposite ceramicsealing materialmicrostructuremechanical property

邹畅、欧阳鑫、周渭良、李志强、郑浦、郭兴忠

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浙江大学材料科学与工程学院,杭州 310058

浙江大学杭州国际科创中心,杭州 311200

浙江东新新材料科技有限公司,台州 318000

碳化硅 复合陶瓷 密封材料 显微结构 力学性能

浙江省"尖兵""领雁"研发攻关计划项目

2021C01073

2024

机械工程材料
上海材料研究所

机械工程材料

CSTPCD北大核心
影响因子:0.558
ISSN:1000-3738
年,卷(期):2024.48(2)
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