电铸液喷射速度对电铸铜微观组织及力学性能的影响
Effect of Injection Speed on Microstructure and Mechanical Properties of Electroforming Copper
沈志豪 1朱增伟 1詹晓非1
作者信息
- 1. 南京航空航天大学 机电学院,江苏 南京 210016
- 折叠
摘要
为了制备性能良好的电铸层,使用扫描喷射的方法进行电铸试验,研究喷射速度对电铸铜力学性能和截面微观组织形貌的影响.结果表明:低喷射速度下铜铸层的力学性能没有明显增强,但延伸性得到一定提高;而在高喷射速度下铜铸层的强度和硬度得到显著提升,同时晶粒尺寸得到均匀细化,晶粒取向更为一致.在 8.3 m/s喷射速度下,铜电铸层的抗拉强度达到 448 MPa.
Abstract
In order to prepare electroforming copper with good performance,the scanning jet process was applied to conduct electroforming for studying the effect of jet speed on the mechanical properties and cross-sectional microstructure of electroforming copper.The results show that the mechanical properties of the electroforming copper are not significantly enhanced at low injection speeds,but the elongation is optimized to a certain extent.The strength and hardness of the electroforming copper are greatly improved at a high injection speed,while the grain size is uniform and refined,and the grain orientation is more consistent.At the jet speed of 8.3 m/s,the tensile strength of the electroforming copper reaches 448 MPa.
关键词
电铸/喷射速度/微观组织/力学性能Key words
electroforming/injection speeds/microstructure/mechanical properties引用本文复制引用
出版年
2024
国家科技期刊平台
NSTL
万方数据