摘要
本征柔性有机电子学是近年来涌现的一项变革性的前沿交叉学科,它赋予电子材料可印刷、可折叠和可拉伸等特性,使其应用于健康医疗、柔性显示、传感探测、人工智能和脑机接口等前沿领域.为了进一步拓展本征柔性有机电子器件的应用场景,设计开发高性能、高显示度、高稳定性的本征柔性材料和有机电子器件是当前的研究重点.本文主要介绍了近年来本征柔性有机电子学相关领域的前沿研究进展,重点讨论了本征柔性材料与有机电子器件的设计和制备策略、本征柔性材料图案化工艺和集成电路,分析了本征柔性有机电子学领域的技术瓶颈和前沿问题,总结和展望了本征柔性有机电子器件的应用前景与未来发展趋势.
Abstract
Intrinsically flexible materials are a new generation of functional materials formed by the aggregation of intermolecular or nano elements through weak interactions.Because of their light weight,printability,folding,extensibility,large-area processing,structure function harmony and super flexibility,they are considered to be interdisciplinary science and technology frontier materials.They are widely applied in fields such as information and energy,including flexible displays,healthcare,aerospace,sensing and detection,logical storage,electronic circuits,photovoltaic energy storage,wearable devices,artificial intelligence,and other cutting-edge technology applications,involving interdisciplinary collaborative research in chemistry,physics,materials,biology,semiconductors,microelectronics,and machinery.In recent years,important research achievements in the field of intrinsically flexible organic electronics have been published in high-level domestic and international journals,with research focusing mainly on materials,devices,patterned processes,and circuits.In terms of materials,in order to endow traditional optoelectronic materials with flexibility and stretchability that they do not possess,researchers mainly attempt strategies including molecular design strategies and doping blending strategies.From the perspective of molecular structures,the molecular design strategy optimizes the interaction between molecules by introducing flexible molecular groups to enhance the intrinsic flexibility of materials.In addition,this strategy can also improve the tensile properties of materials by growing originally rigid materials into one-dimensional nanowires or two-dimensional mesh materials.The doping blending strategy mainly studies the interaction between two materials,usually involving the mixing of one material with intrinsic flexibility and another material without intrinsic flexibility.It regulates the phase separation and assembly morphology at the micro scale and improves its tensile properties without sacrificing performance.In terms of devices,there are two widely reported types of intrinsically flexible optoelectronic thin film devices:Transistors and diodes.Intrinsically flexible transistor devices can achieve high-performance optoelectronic detection,low voltage and low power consumption,and synaptic response behavior through optimization of functional and dielectric layers.Intrinsically flexible diode devices can achieve higher luminescence performance and electrochromic function.In terms of patterning processes,patterning processes applied to the preparation of intrinsically flexible materials and devices mainly include lithography,printing,roll to roll,nanoimprinting,oxygen plasma etching,etc.Among them,lithography and printing are the two most widely reported patterning processes and are considered to be effective ways to achieve large-scale integrated applications of intrinsically flexible materials in the future.In terms of circuits,intrinsically flexible circuits are a cutting-edge research field in the discipline,mainly including synaptic neural network circuits,AMOLED driver display circuits,logic gate circuits,etc.Small scale integrated circuits are a key step in the implementation and application of intrinsically flexible optoelectronic materials and organic devices in the future.This review analyzes and discusses the scientific issues and technological bottlenecks in the cutting-edge research field of intrinsically flexible electronic devices,and summarizes and prospects for future application prospects and development trends.
基金项目
国家自然科学基金(52003274)
国家自然科学基金(61890940)
国家自然科学基金(61890943)
国家重点研发计划(2022YFB3603804)
国家重点研发计划(2023YFB3609000)
国家重点研发计划(2021YFB3200701)
国家重点研发计划(2018YFA0703202)
中国科学院战略性先导科技专项(XDB0520000)
中港联合实验室研究项目(121111KYSB20200036)
维普
万方数据