Low-Cost W-Band Antenna-in-Package Microsystem Based on Wafer Level Packaging with Resin Material
Due to the miniaturization and low-cost requirements of W-band radar detection and wireless communi-cation systems,an antenna-in-package(AiP)microsystem working at 94 GHz is designed.In this article,the integration architecture,the high-frequency interconnection network,and the antenna array of the active AiP are designed and simu-lated based on the fan-out wafer level packaging(FOWLP)with resin material.The AiP microsystem integrates a 4×4 magnetoelectric dipole antenna array and a 16-channel amplitude-phase multifunctional RF chip.Simulated by the An-sys HFSS,an beam scanning range over±30°in the E-plane and±40°in the H-plane can be obtained.The effective iso-tropic radiated power(EIRP)is above 39.1 dBm within a footprint less than 7.1 mm×8.3 mm×1.2 mm.The AiP micro-system is scalable and suitable for detection,communication,and security checking applications.
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