Investigation of Heat Transfer Characteristics of a Swirl Flow Microchannel Heat Sink
The development of highly integrated and miniaturized microelectronic devices leads to an increasing a-mount of heat generated by electronic devices.Consequently,thermal management has become a significant research sub-ject.This paper aims to investigate the heat transfer and flow characteristics of the swirl-flow microchannel heat sink through numerical simulations.Additionally,the effects of coolant flow rate and thermal conductivity of the solid material are discussed.The results indicate that,different from conventional microchannels,the flow patch of coolant increases with increasing of flow rate due to the enhanced swirl flow.This results in the migration of high temperature region to the exit position of the heat sink center and the decrease in the temperature difference.On the other hand,when the ther-mal conductivity of the heat sink increases,the radial and circumferential heat conduction is enhanced,resulting in a de-crease in the average temperature of the heating surface and the high-low temperature difference.
Microchannel heat sinkSwirl flowNumerical simulationTemperature distribution
万方数据
维普
