Research on the Application of Surfactant in CMP Process for Multi-layer Wiring of Integrated Circuits
As integrated circuit(IC)feature sizes continue to shrink,the processing accuracy of IC multi-layer wiring is facing higher demands,and chemical mechanical polishing(CMP),with its coupled synergy of chemical etching and mechanical grinding,is the only reliable technology to achieve local and global wafer planarization.The slurry is one of the key factors in the CMP process,the choice and content of surfactant as the main component can seriously affect the surface quality of wafers.The characteristics of surfactant and its types were introduced,and the application and mechanism of sur-factant in CMP of IC multi-layer wiring-related materials at home and abroad in recent years were reviewed.It is conclu-ded that surfactant can play a variety of roles in CMP process,such as corrosion protection,wetting enhancement,abrasive dispersion,removal of residual contamination on wafer surface and so on,which has a wide range of applications.At the same time,the prospect of surfactant application in CMP was presented.
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万方数据
维普
