首页|Ti掺杂类金刚石薄膜的制备及其高温摩擦学性能研究

Ti掺杂类金刚石薄膜的制备及其高温摩擦学性能研究

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为探究金属Ti掺杂DLC薄膜在高温环境下的摩擦磨损行为,通过射频磁控溅射和直流磁控溅射混合的沉积系统制备不同Ti含量的Ti-DLC薄膜,利用SEM、XRD、Raman、纳米压痕和摩擦试验机等分析Ti含量对Ti-DLC薄膜的微观结构、力学性能及不同温度下的摩擦学性能的影响.结果表明:Ti掺杂使得Ti-DLC薄膜中sp3键的占比随着Ti含量的增加先升高后下降;Ti掺杂提高了 Ti-DLC薄膜的硬度和弹性模量,并一定程度上提升了 Ti-DLC薄膜的膜基结合力.摩擦测试表明:在常温下,Ti-DLC薄膜的摩擦因数和磨损率随Ti含量的增加而下降,但薄膜发生明显的磨粒磨损,且磨损率略高于DLC薄膜;Ti掺杂有效地提高了 DLC薄膜的热稳定性和高温摩擦学性能,在300 ℃的高温下,掺杂薄膜仍维持较低的摩擦因数和磨损率.
Preparation of Ti-doped Diamond-like Carbon Films and Their High Temperature Tribological Properties
Titanium-doped diamond-like carbon(Ti-DLC)films with different content of Ti element were deposited by a hybrid deposition system consisting of direct current(DC)and radio frequency(RF)magnetron sputtering.The effects of Ti contents on the microstructure and mechanical properties of Ti-DLC films were analyzed by SEM,XRD,Ra-man,nano-indentation and friction testing machine.Tribological property of Ti-DLC films at elevated temperature was dis-cussed.The results show that the proportion of sp3 bond in Ti-DLC films first increases and then decreases with the in-crease of Ti content due to Ti doping.Ti doping improves the hardness and elastic modulus of Ti-DLC films,and improves the adhesion force of Ti-DLC films to some extent.The friction coefficient and wear rate of Ti-DLC films at room tempera-ture decrease with the increase of Ti content.However,Ti-DLC films has obvious abrasive wear,and the wear rate is slight-ly higher than DLC film.Ti doping can effectively improve the thermal stability and high temperature tribological properties of DLC films.At 300 ℃,the friction coefficient and wear rate of Ti-doped films are still low.

diamond-like carbon filmsmagnetron sputteringelement dopingmechanical propertyhigh-temperature friction

刘怡飞、李助军、陈泽达、苏峰华

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广州铁路职业技术学院机电工程学院,广东广州 511300

华南理工大学机械与汽车工程学院,广东广州 510640

类金刚石薄膜 磁控溅射 元素掺杂 力学性能 高温摩擦

国家自然科学基金项目2020年度普通高校重点科研项目广州市基础研究计划基础与应用基础研究项目广东省自然科学基金项目173项目

521751682020ZDZX20892022010115952022B15152500032021-JJ-0175

2024

润滑与密封
中国机械工程学会 广州机械科学研究院有限公司

润滑与密封

CSTPCD北大核心
影响因子:0.478
ISSN:0254-0150
年,卷(期):2024.49(10)
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