微量磷元素对低银系无铅钎料抗氧化性能的影响
Effect of P on Oxidation Resistance of Low-silver Lead-free Solder
粟慧 1卢斌 2朱华伟2
作者信息
- 1. 常州工学院 机电工程学院,江苏常州213002
- 2. 中南大学 材料科学与工程学院,湖南长沙410083
- 折叠
摘要
研究了不同微量P元素对Sn-0.3Ag-0.7Cu低银系无铅钎料抗氧化性的影响.钎料在液态下的表面颜色变化以及氧化渣增重曲线分析表明,P的加入可以提高钎料的抗氧化性能.通过X射线衍射分析探讨了合金元素的抗氧化机理:微量P在钎料表面富集,P替代了Sn优先被氧化,在焊料表面形成了P2O5氧化物膜“阻挡层”,抑制了钎科的进一步氧化.比较发现,P的最佳含量为0.015wt％.
Abstract
Researching the oxidation case of Sn-0.3Ag-O.7Cu lead-free solder which is used the most now, the effect of microelement P on the oxidation resistance of Sn-0.3Ag-0.7Cu was studied. Adding microelement P can improve the Oxidation Resistance of Sn-0.3Ag-0.7Cu by the results of changes of solder wettability and the dross formation, It is concluded that the optimal content is 0.015wt%. It found that microelement P is concentrated at the surface of the solder and form a P2O5 oxidation barrier, consequently protect the solders from further oxidation.
关键词
无铅钎料/抗氧化/P的影响/锡渣Key words
lead-free solder/oxidation resistance/effect by P/dross引用本文复制引用
出版年
2012
NETL
NSTL
维普
万方数据