Effects of Annealing Temperature on Microstructure and Comprehensive Properties of Bonding Gold Ribbon
The effects of different annealing temperatures on the microstructure,mechanical properties and electrical properties of the gold ribbon were investigated by focused ion beam(FIB),scanning electron microscope(SEM),mechanical and electrical properties test equipment.The results show that deformed microstructure of the gold ribbon generates elongated grains with{001}～{110}〈111〉orientation along the rolling direction.Gold ribbon nucleates and generates{001}～{110}〈001〉texture annealed at 300℃,and the strong cube({100}〈001〉)orientation forms at just complete recrystallization when annealing temperature rises to 500℃.The tensile strength of gold ribbon decreases,while elongation and conductivity increase with the increase of annealing temperature.The tensile strength and the elongation of gold ribbon change significantly annealed above 200℃and 400℃,respectively.The conductivity of gold ribbon increases significantly annealed at 250℃and 400℃,which is due to the obvious recovery and recrystallization,thus the number of point defects and dislocations significantly decreases,resulting in the significant increase of the conductivity.
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