Study on Bonding and Interface Behavior of New Electrode Mg2SiNi3 and Mg2Si
Mg2Si-based thermoelectric material is one of the promising thermoelectric materials in the middle-temperature range.To improve the interfacial properties of Mg2Si based thermoelectric joints,a novel electrode material Mg2SiNi3 used as Mg2Si electrode material was proposed,and the connection between Mg2SiNi3 and Mg2Si was realized by discharge plasma sintering(SPS).At the same time,the interfacial morphology,interfacial electrical properties,mechanical properties and stability of the joints were analyzed.The results show that the Mg2SiNi3 and the Mg2Si have formed a complete metallurgical bond after sintering,and all the components at the interface have achieved uniform transition.The interface contact resistance is optimized effectively,and the joints have good interfacial stability.Before and after aging,no significant degradation of interface performance occurs.The proposed Mg2SiNi3 provides a new idea for the design and integration of Mg2Si-based thermal appliances.