Research on Wettability and Interface Growth Characterization of Ag-GNSs/Sn-Ag-Cu Composite Solder Joints
Taking Ag coated graphene nanosheets(Ag-GNSs)as the reinforcement,new composite lead-free solders Sn-3.0Ag-0.5Cu-(Ag-GNSs)were prepared.The solder joints were prepared on the Cu matrix,and the isothermal aging treatment at 150℃for different time was carried out.The effects of different content of Ag-GNSs on the wettability of the lead-free solder Sn-3.0Ag-0.5Cu and characteristic of intermetallic compound(IMC)at the interface between Cu matrix and solder were studied.The results show that appropriate amount of Ag-GNSs can significantly improve the wettability of the solder,the wettability is best when the Ag-GNSs content reaches 0.05wt%,and the wetting angle is reduced by 54.43%compared with that of Sn-3.0Ag-0.5Cu solder.The IMC layer becomes thicker with the extension of the isothermal aging time,and its growth behavior is controlled by diffusion.The addition of Ag-GNSs can inhibit the growth of the IMC layer.The diffusion coefficient reaches the minimum value of 2.356×10-18 m2/s when the Ag-GNSs content is 0.05wt%.The optimal addition amount of Ag-GNSs is 0.05wt%in the range of 0-0.2wt%.
Ag coated graphene nanosheets(Ag-GNSs)Sn-3.0Ag-0.5Cu solderwettabilityIMC layer
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