Ag-GNSs/Sn-Ag-Cu复合钎料焊点的润湿性能及界面生长特征研究
Research on Wettability and Interface Growth Characterization of Ag-GNSs/Sn-Ag-Cu Composite Solder Joints
高子旋 1屈敏 1康博雅 1崔岩1
作者信息
- 1. 北方工业大学 机械与材料工程学院,北京 100144
- 折叠
摘要
采用Ag涂覆石墨烯纳米片(Ag-GNSs)作为增强体,制备Sn-3.0Ag-0.5Cu-(Ag-GNSs)新型复合无铅钎料,然后在Cu基板上制备了钎料焊点,并进行了 150℃不同时长的等温时效处理,研究了不同含量的Ag-GNSs对无铅钎料Sn-3.0Ag-0.5Cu的润湿性、Cu基板/钎料界面金属间化合物(IMC)生长特性的影响.结果表明,适量的Ag-GNSs可以显著地改善钎料的润湿性,当Ag-GNSs含量达到 0.05wt%时润湿性最佳,与Sn-3.0Ag-0.5Cu钎料相比润湿角降低了54.43%.随着等温时效时间的延长,IMC层厚度增大,其生长行为由扩散控制.Ag-GNSs的添加可以抑制IMC层的生长,当Ag-GNSs的含量为 0.05wt%时扩散系数达到最小值 2.356×10-18 m2/s.在 0～0.2wt%范围内,Ag-GNSs的最佳添加量为 0.05wt%.
Abstract
Taking Ag coated graphene nanosheets(Ag-GNSs)as the reinforcement,new composite lead-free solders Sn-3.0Ag-0.5Cu-(Ag-GNSs)were prepared.The solder joints were prepared on the Cu matrix,and the isothermal aging treatment at 150℃for different time was carried out.The effects of different content of Ag-GNSs on the wettability of the lead-free solder Sn-3.0Ag-0.5Cu and characteristic of intermetallic compound(IMC)at the interface between Cu matrix and solder were studied.The results show that appropriate amount of Ag-GNSs can significantly improve the wettability of the solder,the wettability is best when the Ag-GNSs content reaches 0.05wt%,and the wetting angle is reduced by 54.43%compared with that of Sn-3.0Ag-0.5Cu solder.The IMC layer becomes thicker with the extension of the isothermal aging time,and its growth behavior is controlled by diffusion.The addition of Ag-GNSs can inhibit the growth of the IMC layer.The diffusion coefficient reaches the minimum value of 2.356×10-18 m2/s when the Ag-GNSs content is 0.05wt%.The optimal addition amount of Ag-GNSs is 0.05wt%in the range of 0-0.2wt%.
关键词
Ag涂覆石墨烯纳米片(Ag-GNSs)/Sn-3.0Ag-0.5Cu钎料/润湿性/IMC层Key words
Ag coated graphene nanosheets(Ag-GNSs)/Sn-3.0Ag-0.5Cu solder/wettability/IMC layer引用本文复制引用
出版年
2024
NETL
NSTL
万方数据