The dispersed carbon nanotubes were attached to the surface of copper foil by diffusion bonding method.After cutting,stacking and pre-pressing,CNTs/Cu layered composite with excellent conductivity were prepared by sintering in vacuum hot pressing sintering furnace.The microscopic characterization of CNTs/Cu layered composite was carried out by SEM,EDS and XRD.Sample performance was tested using a microhardness meter and a conductivity detector,etc.The results show that during hot pressing sintering,a certain amount of copper diffuses into CNTs layer,which effectively improves the bonding ability between CNTs layer and copper layer.Compared with pure copper,CNTs/Cu layered composite not only improve the hardness by 45%,but also achieve 91%IACS in the direction parallel to the carbon nanotube layer and 80.6%IACS in the direction perpendicular to the carbon nanotube layer.
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