Research on Effects of Annealing Process on Interface of Cu/Al Cladding Materials
The pure copper/pure aluminum and pure copper/aluminum alloy were used for 400 ℃ warm rolling and annealing heat treatment,and the interface binding strength test,interface metallophase microstructure analysis and interface SEM analysis were also performed for the resulting Cu/Al cladding materials.The results show that,the formation of the Cu/Al mesophase at the Cu/Al cladding materials interface requires a certain gestation period,and the formation process is:nucleation→nucleation growth→continuous growth along the interface laterally→vertical direction along the normal direction of the interface growth.The best annealing process of pure copper/pure aluminum cladding materials is 300 ℃ ×1h,and the maximum interface bonding strength can reach 2.4 N/mm.While the pure copper/aluminum alloy is 300 ℃ ×3 h,the maximum interface bonding strength is 3.1 N/mm,which ensures the formability of the materials and prevents the formation of intermetallic compounds.The pure copper/pure aluminum alloy is more likely to form a brittle intermetallic compound phase than the pure copper/pure aluminum cladding material interface,which can lead to the decrease of the interface bonding strength and the brittle fracture of the interface under peeling conditions.
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