Research Progress on Microstructure and Properties of Lead-free Solder Joints
In recent years,electronic components have gradually become indispensable equipment because of their miniaturization,high efficiency,versatility and high integration.Brazing technology is widely used in the field of electronic packaging.However,in the process of brazing,the wettability of the filler metal on the substrate will affect the interconnection between the component and the substrate,and the microstructure and growth behavior of the intermetallic compounds formed at the solder joint will affect the joint performance,thus affecting the reliability of the solder joint.In order to obtain high quality solder joints,it can be achieved by changing the composition of the filler metal such as adding nanoparticles,electroless plating or alloying of the substrate,controlling brazing process parameters and aging treatment.The research of domestic and foreign scholars on the influence of the above factors on the interface wettability,microstructure and properties of joint was summarized in detail,which can provide certain reference for the subsequent research.
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