基于专利引用的通信芯片产业创新网络韧性研究
Resilience of the Innovation Network in the Communication Semiconductor Industry Based on Patent Citations
周霞 1于娱 2施琴芬3
作者信息
- 1. 河海大学商学院,南京 211100
- 2. 南京审计大学商学院,南京 211815
- 3. 苏州科技大学商学院,江苏苏州 215009
- 折叠
摘要
基于2000-2021年全球通信芯片专利引用数据,构建产业创新网络,从静态和动态两个方面对不同技术发展阶段下的网络韧性进行测度.结果表明:(1)全球通信芯片产业创新网络具有无标度性和异质性特征,2000-2021年,网络韧性呈现"正—正—负"的演化趋势.(2)不同技术发展阶段中,美国企业节点失效始终使得网络综合韧性值居于最低水平;韩国、中国大陆和中国台湾三地企业2008年后对网络韧性的影响力愈发凸显.(3)网络对随机扰动表现出更强韧性,对有针对性的蓄意攻击更为敏感.
Abstract
Based on global communication semiconductor patent citation data from 2000 to 2021,the paper establishes an in-dustry innovation network and evaluates network resilience across various technological development stages from static and dynamic perspectives.It finds that:(1)the innovation network of the global communication semiconductor industry displays scale-free and heterogeneous characteristics,with network resilience evolving in a"positive-positive-negative"pattern from 2000 to 2021.(2)Across diverse technological development stages,U.S.corporate nodes'failure consistently results in the lowest overall network resilience values.The influence of enterprises from South Korean,Chinese Mainland,and Chi-nese Taiwan on network resilience has markedly intensified since 2008.(3)The network exhibits heightened resilience in response to random disturbances but proves more susceptible to deliberate,targeted attacks.
关键词
芯片产业/创新网络/静态韧性/动态韧性/专利引用Key words
semiconductor industry/innovation network/static resilience/dynamic resilience/patent citations引用本文复制引用
出版年
2024
NETL
NSTL
万方数据