首页|三维表面裂纹扩展轨迹与数值仿真研究

三维表面裂纹扩展轨迹与数值仿真研究

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针对三维表面裂纹扩展形态和轨迹难以预测的特点,基于ANSYS有限元分析软件,利用三维裂纹扩展仿真方法,开发三维裂纹扩展程序,研究典型的三维表面单裂纹与三维非等大共面表面双裂纹扩展轨迹,实现了任意三维多裂纹扩展轨迹的数值模拟.主要研究内容与结论如下:针对三维表面单裂纹模型,当初始裂纹形状c/a>1 时,最深处的应力强度因子值大于自由表面处应力强度因子值,随着裂纹的不断扩展,前缘会渐渐趋于稳定的圆形.而对于三维非等大共面表面双裂纹,较大的裂纹扩展速率大于较小的裂纹.开始时 2 条裂纹均沿光滑的样条曲线扩展,后来受到另一条裂纹的影响,在彼此接近处,由于应力放大作用,此部位的应力强度因子变大,扩展速率也会高于裂纹前缘其他部位.
Study on the propagation path and numerical simulation of surface cracks in three-dimensional structures
To address the difficulty in predicting the morphology and trajectory of three-dimensional surface cracks,a three-dimensional crack propagation simulation method was developed based on the ANSYS finite element analysis software,and a program for simulating three-dimensional crack propagation was developed.The study investigated the propagation trajectories of typical three-dimensional surface single and multiple cracks,and achieved numerical simulation of arbitrary three-dimensional multiple crack propagation trajectories.The main contents and conclusions of this article are as follows:For the three-dimensional surface single crack model,when the initial crack shape is c/a>1,the stress intensity factor at the deepest point is greater than the stress intensity factor at the free surface,and as the crack continues to propagate,the crack tip gradually stabilizes into a circular shape.However,for non-coplanar surface bimodal cracks in three dimensions,the larger crack has a faster propagation rate than the smaller one.Initially,both cracks propagate along a smooth spline curve,but later,they are influenced by each other,and at the point where they approach each other,the stress intensity factor increases due to stress concentration,causing the propagation rate to be higher than other parts of the crack tip.

finite element methodnumerical simulationstress intensity factorthree-dimensional multiple crackscrack propagation path

赵慧、王瀚阳

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西安航空学院 飞行器学院,西安 710077

西北工业大学 航空学院,西安 710072

有限元方法 数值模拟 应力强度因子 三维多裂纹 裂纹扩展轨迹

2024

兵器装备工程学报
重庆市(四川省)兵工学会 重庆理工大学

兵器装备工程学报

CSTPCD北大核心
影响因子:0.478
ISSN:2096-2304
年,卷(期):2024.45(3)
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