摘要
环氧树脂是电子器件常用的绝缘高分子基体材料,但存在导热性偏低的问题.六方氮化硼(h-BN)常被用于环氧树脂的导热填料,而h-BN的化学惰性使其在环氧树脂中的分散性和相容性较差,限制了其作用的发挥,因而对其进行改性就成了导热绝缘环氧树脂复合材料制备中需要面对的一个重要问题.本文主要总结了近年来用于导热绝缘环氧树脂复合材料的氮化硼的改性方法及其特点,其中包括剥离、包覆、场取向和杂化等物理方法,以及功能化、偶联剂修饰、活性剂修饰、化学接枝等化学方法,并对BN改性今后的发展趋势进行了讨论.
Abstract
Epoxy resin is the common insulative polymer matrix used in electronic device,which is lower in thermal conductivity.Hexagonal boron nitride(h-BN)is usually applied as the thermal conductive filler for epoxy resin,but its effects are limited for the poor dispersion and compatibility in epoxy resin from its chemical inertness,thus,the modification of BN is the highlighted issue encountered in fabricating thermally conductive,insulative epoxy resin composites.The paper mainly reviewed the recently developed modification methods of BN and the characteristics,including the physical methods such as physical exfoliation,encapsulation,hybridizing,and field-induced orientation,and the chemical methods like functionalization,coupling agent modification,surfactant modification,and chemical grafting.The futural development trend in BN modification is also discussed.
基金项目
淄博市重点研发计划(市外校城融合)项目(2020XCCG0122)
山东省科技型中小企业创新能力提升工程项目(2022TSGC1205)
NETL
NSTL
万方数据