The Progress on Modification of BN Used in Fabricating Thermally Conductive,Insulative Epoxy Composites
Epoxy resin is the common insulative polymer matrix used in electronic device,which is lower in thermal conductivity.Hexagonal boron nitride(h-BN)is usually applied as the thermal conductive filler for epoxy resin,but its effects are limited for the poor dispersion and compatibility in epoxy resin from its chemical inertness,thus,the modification of BN is the highlighted issue encountered in fabricating thermally conductive,insulative epoxy resin composites.The paper mainly reviewed the recently developed modification methods of BN and the characteristics,including the physical methods such as physical exfoliation,encapsulation,hybridizing,and field-induced orientation,and the chemical methods like functionalization,coupling agent modification,surfactant modification,and chemical grafting.The futural development trend in BN modification is also discussed.
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