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含氟聚酰亚胺薄膜的制备及性能研究

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将六氟二胺(HFBAPP)、4,4'-二氨基二苯醚(ODA)两种二胺与 3,3',4,4'-联苯四羧基二酐(BPDA)、六氟二酐(6FDA)两种二酐进行缩聚反应,采用涂覆法成功合成了三种含氟聚酰亚胺薄膜(PI-1、PI-2、PI-3),并对其进行表征及介电性能、热稳定性能和力学性能研究.结果表明,在1 MHz下,主链中含较多三氟甲基的PI-1 介电常数最低,为2.71,优于商用聚酰亚胺(Kapton)薄膜,氟原子含量最高的PI-1 吸水率最低,为0.24%,在三种含氟PI中具有最高的接触角和最低的吸水率.三种含氟PI的Td5和Td10分别在 496~526℃和515~544℃,且在 800℃的碳产率均在 50%以上,具有良好的热稳定性,同时三种PI薄膜的拉伸强度仍满足使用要求.
Preparation and Properties of Fluorinated Polyimide Thin Film
Hafluorodidiamine(HFBAPP),4,4'-diamino diphenyl ether(ODA)two diamines with 3,3',4,4'-biphentetracarboxylic anhydride(BPDA),hexafluorodihydride(6FDA)two dianhydride species for polycondensation reactions,three fluorinated polyide films(PI-1,PI-2,PI-3),charactercharacterization and dielectric properties,thermal stability and mechanical properties.The results show that at 1 MHz,the PI-1 containing more trifluoromethyl group in the backbone has the lowest dielectric constant of 2.71,which is better than the commercial polyimide(Kapton)film,and the PI-1 with the highest fluorine atomic content has the lowest water absorption,0.24%,which has the highest contact angle and the lowest water absorption among the three fluorine PI.The three fluorine PI Td5 and Td10 are in the range of 496℃ to 526℃ and 515℃ to 544℃,respectively,and the carbon yield at 800℃ is above 50%,with good thermal stability,and the tensile strength of the three PI films still meets the use requirements.

fluoropolimidedielectric propertiesthermal stability

宋诗慧、樊立平、胡晓丹、常树全

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南京航空航天大学 材料科学与技术学院,江苏 南京 211100

含氟聚酰亚胺 介电性能 热稳定性

基础科研计划项目国家自然科学基金

JCKY2021605B03112275131

2024

山东化工
山东省化工研究院 山东省化工信息中心

山东化工

影响因子:0.249
ISSN:1008-021X
年,卷(期):2024.53(11)