首页|振实法筛选球形氧化铝及导热硅橡胶性能研究

振实法筛选球形氧化铝及导热硅橡胶性能研究

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导热硅橡胶被广泛用于促进电子和储能设备的散热.将不同粒径的氧化铝复配使用,可以产生协效作用,提高导热硅橡胶的性能.探索一种快速筛选氧化铝优化复配比例的新方法(振实法),研究其在球形氧化铝及其导热硅橡胶中的应用效果.以平均粒径约为40 μm和5μm的球形氧化铝为导热填料,通过振实法筛选出最密堆积状态对应的复配质量比例为16∶4.根据这一比例(16∶4)以及相近的4个比例,制备5种导热硅橡胶.当氧化铝的复配质量比例为16∶4,所制得的导热硅橡胶相比于其他复配比例的样品具有最优的性能,具备低硬度(邵氏OO 70)、高导热系数(3.3 W·m-1·K-1)、高可靠性(在135 ℃加速热老化1 000 h后,绝大多数性能变化幅度小于10%)的优点.在导热硅橡胶的研究和产品开发中,采用振实法可以显著减少盲目性,加快配方优化速度,减少开发时间,降低原材料成本,有望为导热硅橡胶的性能优化、降本增效等提供可行、高效的策略和工具.
Study on the Performance of Spherical Alumina and Thermal Conductive Silicone Rubber Screening by Tapping Method
Thermally conductive silicone rubber(TCSR)is widely used to promote heat dissipation in electronics and energy storage devices.The compounding of alumina of different particle sizes can produce the synergistic effects and improve the performance of TCSR.A new method(the tapping method)for rapid screening of alumina to optimize the compounding ratio and investigates its effectiveness in the application of spherical alumina,and the TCSR with these fillers.Spherical alumina with the average particle sizes of 40 μm and 5 µm,respectively,is used as the thermally conductive fillers.The densest stacking state is screened out to be 16∶4 by the tapping method.Based on the optimum ratio(16∶4)and four similar ratios,five TCSRs are prepared.When the optimal compounding ratio is 16∶4,the TCSR with this ratio has optimal properties compared to samples with other compounding ratios,and the 16+4@TCSR can achieve,low hardness(Shore OO 70),high thermal conductivity(3.3 W·m-1·K1),and high thermal reliability(less than 10%variation in most properties after 1 000 h of 135℃ accelerated thermal aging).In the research and development of TCSR,the use of the tapping method can significantly reduce the unpredictability,accelerate the speed of dispensing optimization,reduce the development time and the cost of raw materials.It is expected to provide the feasible and efficient strategy and tool for optimizing the performance,reducing costs,and increasing efficiency of TCSR.

thermally conductive silicone rubberthermal conductive fillerthe compounding ratiothermal conductivity

国鑫华、包晨露

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天津工业大学材料科学与工程学院,天津 300387

导热硅橡胶 导热填料 复配比例 导热系数

2024

山东化工
山东省化工研究院 山东省化工信息中心

山东化工

影响因子:0.249
ISSN:1008-021X
年,卷(期):2024.53(20)