Effect of Al2O3 Content on Performances of PTFE/SiO2 Composite Films
Multi-layer circuit board has the problem of poor heat dissipation performance,which limits its application in high frequency circuit.In this experiment,polytetrafluoroethylene(PTFE)/SiO2 high thermal conductivity composite film materials were prepared with Al2O3 as filler to enhance the thermal conductivity of multi-layer circuit boards.PTFE/SiO2 composite films were prepared by impregnation process combined with high temperature sintering by adding different amounts of Al2O3 into PTFE.The effects of Al2O3 content on the microstructure,density,thermal conductivity and mechanical properties of PTFE/SiO2 composite films were studied.The results show that with the increase of Al2O3 content,the thermal conductivity of the composite film shows an upward trend,and the density and mechanical strength show a trend of increasing first and then decreasing.When the Al2O3 content is 4%,the PTFE/SiO2 composite film(sample 3)has the least micro-defects,the highest density and mechanical strength,and has a reasonable thermal conductivity and electrical insulation.The density of sample 3 is 2.119 g/cm3,the mechanical strength is 17.3 MPa,the thermal conductivity is 0.98 W/(m·K),and the volume resistivity is 380.9 GΩ·m.
万方数据
