Junction Temperature Calculation by Thermal Network Method Considering IGBT Module Bonding Wire and Chip Solder Layer Aging
This paper proposes a thermal network method for junction temperature calculation that takes the aging of IGBT module bonding wires and chip solder layers into account.The interdependence between loss and junction temperature in short time scales is updated based on Simulink,the two-pulse test and finite Meta-simulation corrects the influence of bonding wire and chip solder layer aging on IGBT junction temperature calculation under long-term scale.Correlation,more accurate calculation of IGBT junction temperature.Finally,the accuracy of the proposed junction temperature calculation method is verified by comparing the experimental platform with the traditional junction temperature calculation method.The junction temperature calculation method is helpful to accurately calculate the junction temperature under the actual operating conditions and the aging state of the IGBT module.
IGBT junction temperature calculationthermal network model methodmodule agingdouble pulse testfinite element simulation
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