Ultra-wideband T/R Module Based on Silicon Stack SIP Technology
The traditional ultra-wideband T/R module is a two-dimensional brick structure,the volume and weight are not suit-able for the miniaturized,low profile and conformal phased array antenna.In this paper,the four-channel radio frequency(RF)chips are highly integrated on the silicon-based substrate based on the silicon stack system in package(SIP)technology,and the multilayer substrate is thick gold pressed to achieve multi-layer stacked 3D packaging.The 3D stacked four-channel ultra-wideband T/R module is realized by adopting multi-function integration technology of chip and vertical interconnection technology of ultra-wideband RF signal.The bandwidth of the T/R module is 6 GHz～18 GHz,single-channel transmitting power is better than 23 dBm,the receiving gain is better than 20 dB,6 bit digital control attenuation and 6 bit digital control phase shift are realized,the size is only 13.0 mm×13.0 mm×3.4 mm.This technology can realize SIP packaging of multi-channel ultra wideband T/R module,which is beneficial for engineering applications.
T/R moduleultra-widebandsilicon substratesystem in packagestack
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维普
