Analysis of"mushroom-hot air"interaction process based on multi-coupled physical fields
In order to understand the process of hot air drying of shiitake mushrooms,the internal temperature,mois-ture,stress changes and distribution rules of the shiitake mushrooms were investigated by COMSOL Multiphysics simulation combined with drying test based on multi-coupled physical field.The results show that under the drying conditions of 40 ℃,55 ℃ and 70 ℃,the water loss rate of the mushroom was 3.7％/h,6.2％/h and 12％/h,and the total shrinkage rate was 12.03％,18.41％and 24.23％,respectively.Combined with the simulation results,it was found that the higher the drying temperature,the faster the temperature rise,and the greater the wet stress and thermal stress inside the mushroom.The change of water content in the drying process was related to the tempera-ture,and the water in the part where the temperature rose first began to dissipate.The main stress affecting the strain of the shiitake mushrooms is the thermal stress,and the greater the thermal stress during drying,the greater the strain of shiitake mushrooms.The research can provide a theoretical basis for the hot air drying technology of shi-itake mushroom.
shiitake mushroomshot air dryingemulationwater loss
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