Research on Current Situation of Temperature and Humidity Highly Accelerated Stress Test(HAST)Capability of Compound Semiconductors
Based on the current situation of GaAs pHEMT wafer process,this paper studies from three dimensions:chip design,wafer process control,and packaging material selection according to different material characteristics.It reports the current situation faced by compound semiconductors with relatively complex material combinations in terms of temperature and humidity Highly Accelerated Stress Test(HAST)capabilities.Through typical case analysis,the key points that such compound semiconductors need to pay attention to in the design and process control are explained,which can be used for reference in similar chip design or process development work.
compound semiconductorGaAspHEMTHASTtemperature and humidity stress test capability
国家科技期刊平台
NSTL
万方数据
维普
