Thermal Design of a Portable Device Based on ANSYS Icepak
Aiming at the thermal design of a portable device,according to the requirements of the using environmental conditions,this paper determines the heat dissipation mode of the chassis through calculating the surface heat flux and allowable temperature rise,then chooses the suitable fans and rationally arranges the location of modules inside the chassis,and determines the structure model of the chassis.It uses UG(3D modeling software)to carry out modeling for the chassis prototype,and combines the ANSYS Icepak(thermal simulation analysis software)for thermal simulation analysis calculation to verify the rationality of the thermal design scheme of the chassis and the suitability of the fans.The combination of theoretical analysis and software simulation can highly improve the efficiency and reliability of the thermal design of the electronic device,and provide a reference for future thermal design of the electronic device.
国家科技期刊平台
NSTL
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