首页|基于正交算法的车规级芯片耦合故障研究

基于正交算法的车规级芯片耦合故障研究

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从汽车芯片信息安全角度出发,由于汽车安全芯片工作主要受环境中的电磁、电压和光的影响,在阐明了电磁、电压和光对安全芯片的影响原理的基础上,综合考虑影响芯片工作的三种因素和因素间的相互作用,提出了多维组合的车规级安全芯片故障注入测试技术。以典型安全芯片为例,对其进行电磁操纵、电压操纵、光注入以及三者的组合注入,比较故障注入前后安全芯片加密解密得到的密文或明文,从而能够得出安全芯片的安全性结论。
Research on Coupling Fault of Automotive Gauge Level Chip Based on Orthogonal Algorithm
From the perspective of cyber security of automotive chips,the operation of automotive encryption chips is mainly influenced by the electromagnetic,voltage and light in the environment.Based on elucidating the principle of the influence of electromagnetic,voltage and light on encryption chips,this paper considers the three factors and their interactions,and proposes a multi-dimensional combination of automotive gauge level encryption chip fault injection testing technology.Taking a typical encryption chip as an example,by performing electromagnetic manipulation,voltage manipulation,optical injection,and a combination of the three,the encrypted or plaintext obtained by encrypting and decrypting the encryption chip before and after fault injection is compared,and the security conclusion of the encryption chip is drawn.

fault injectioncyber securityautomotive gauge gradeencryption chip

张胜强、李明阳、翟瑞卿、李帅东、李予佳

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中国汽车技术研究中心有限公司,天津 300163

南开大学 网络空间安全学院,天津 300071

故障注入 信息安全 车规级 安全芯片

2024

现代信息科技
广东省电子学会

现代信息科技

ISSN:2096-4706
年,卷(期):2024.8(12)
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