Research on Failure Distribution and Reliability Evaluation of Smart TV Main Board
The maximum working temperature of the smart TV main board is tested and the maximum working temperature of the main board is obtained.Thermal imaging technology is used to analyze the temperature field of the main board at room temperature and high temperature,and it is found that the thermal weak link of the main board is caused by high temperature aging,resulting in MOS failure of the backlight power switch.According to these results,based on the principle of accelerated life test,the accelerated factor of accelerated life test is obtained using the Arrhenius model.By conducting temperature accelerated test on the main board and collecting failure data,the failure data is analyzed and a failure distribution model is established.By estimating the parameters of the failure distribution,the basic failure rate of the main board is obtained to be 0.71×10-6/h.At the same time,the environmental coefficients of the main board under different usage environments are provided.
smart TV main boardfault distributionaccelerated test
国家科技期刊平台
NSTL
万方数据
