Processing of Molybdenum-copper and Tungsten-copper Carrierby Wire Electrical Discharge Machining
The carrier of molybdenum-copper and tungsten-copper material was more and more widely used in the field of heat sink production and electronic packaging because of its extremely low porosity.However,due to the characteristics of high hardness and thin thickness of the carrier material,the traditional mechanical processing method could not effectively process it.Wire Electrical Discharge Machining(WEDM),a non-contact special processing method,provided a solution for the smooth processing of this material.WEDM was a kind of technology,which provided voltage between the tool electrode and the workpiece,and used the pulse spark discharge energy between the two to remove the excess metal on the workpiece surface,so that the workpiece got the required shape,size precision,surface quality.We analyzed the characteristics of mo-lybdenum-copper and tungsten-copper materials,found out the corresponding WEDM scheme,and designed relevant pro-cessing experiments,so as to explore the overall process scheme and process parameters,and process the products that met the technical requirements.This processing method provided a valuable reference for the subsequent development of more efficient and higher precision processing of molybdenum-copper and tungsten-copper carriers.
wire electrical discharge machiningmolybdenum-copper and tungsten-copperdischarge parameterspro-cessing technology
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