系统工程与电子技术2024,Vol.46Issue(5) :1682-1690.DOI:10.12305/j.issn.1001-506X.2024.05.21

基于质量4.0的印制电路板智能缺陷检测研究

Intelligent defect detection based on Quality 4.0:a case study of printed circuit board

刘虎沉 李珂 王鹤鸣 施华
系统工程与电子技术2024,Vol.46Issue(5) :1682-1690.DOI:10.12305/j.issn.1001-506X.2024.05.21

基于质量4.0的印制电路板智能缺陷检测研究

Intelligent defect detection based on Quality 4.0:a case study of printed circuit board

刘虎沉 1李珂 1王鹤鸣 1施华2
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作者信息

  • 1. 同济大学经济与管理学院,上海 200092
  • 2. 上海电机学院材料学院,上海 201306
  • 折叠

摘要

新一代信息技术的高速发展为制造业的转型与发展提供了机遇,同时也推动了制造质量管理方式的重大变革.本文结合制造业发展实际情况,概述了质量4.0的基本理论及关键技术,并进一步探讨了质量4.0的实施与落地应用.具体而言,将印制电路板(printed circuit board,PCB)缺陷检测作为研究案例,设计了基于质量4.0的PCB智能缺陷检测方案,并提出了缺陷检测的5个关键评价标准;提出的检测方案可有效帮助PCB制造企业过滤缺陷假点、控制产品良率、获取缺陷解决建议,并为员工掌握专业检测技能提供学习和培训平台.本文旨在研究质量4.0环境下的智能缺陷检测及其PCB中的应用,以推动制造业质量管理数字化和智能化转型.

Abstract

With the rapid development of information technologies,we can find more opportunities to transform and develop the manufacturing industry,which drives the significant transformation of quality management methods.Based on the actual situation of the manufacturing industry,this work outlines the basic theory and key technologies of Quality 4.0,and further explore the application and implementation of Quality 4.0.Specifically,the printed circuit board(PCB)manufacturing is taken as an example,and design an intelligent defect detection scheme is design during PCB production based on the Quality 4.0 theory.And five key evaluation criteria for defect detection have been proposed.The proposed testing scheme can effectively help PCB manufacturing enterprises filter out false defects,control product yield,obtain defect resolution suggestions,and provide a learning and training platform for employees to master professional testing skills.This paper aims to study intelligent defect detection in the Quality 4.0 environment and its application in PCB,in order to promote the digital and intelligent transformation of manufacturing quality management.

关键词

质量4.0/质量管理/印制电路板制造/缺陷检测/智能制造

Key words

Quality 4.0/quality management/printed circuit board(PCB)manufacturing/defect detection/intelligent manufacturing

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基金项目

中央高校基本科研业务费专项(22120230184)

出版年

2024
系统工程与电子技术
中国航天科工防御技术研究院 中国宇航学会 中国系统工程学会

系统工程与电子技术

CSTPCD北大核心
影响因子:0.847
ISSN:1001-506X
参考文献量42
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