Abstract
Based on the fact that it is challenging for the polymer flexible circuit substrates to meet the requirements of serving in high-temperature environments,this work proposed the idea of using printable ceramic fiber paper as a high-temperature flexible circuit substrate.A ceramic fiber paper with all ceramic components had been devel-oped via electrospinning,solving the problems of low strength and severe strength drop at high temperatures of traditional ceramic fiber paper.The tensile strength of the prepared ceramic fiber paper is 2.63 MPa,and the reliable service temperature is 1200 ℃.Its bulk density is about 1.5 times that of traditional ceramic fiber paper.It can be printed with patterns by commercial inkjet printers like ordinary printing paper and has excellent printability.The feasibility of ceramic fiber paper as a flexible circuit sub-strate was verified by constructing a simple circuit.When the fiber paper is significantly bent,the circuit still forms a complete path,which proves that it has a strong application potential for high-temperature flexible circuit substrate and is expected to promote the development of flexible elec-tronic devices serving at extreme high-temperature envi-ronments.
基金项目
国家自然科学基金(52202090)
国家自然科学基金(52102093)
中国博士后科学基金(2021M690817)
Heilongjiang Provincial Postdoctoral Science Foundation(LBH-Z21050)
Heilongjiang Provincial Postdoctoral Science Foundation(LBH-Z20144)
State Key Laboratory of Intelligent Manufacturing Equipment and Technology(IMETKF2023004)
NETL
NSTL
万方数据