首页|High-current pulsed electron beam modification on microstructure and performance of Cu/CuW diffusion bonding joints
High-current pulsed electron beam modification on microstructure and performance of Cu/CuW diffusion bonding joints
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This study investigates the influence of high-current pulsed electron beam(HCPEB)modification on the microstructure and shear strength of Cu/CuW joints.Reliable solid-state diffusion bonding of modified-Cu(M-Cu)and modified-CuW(M-CuW)was achieved by HCPEB modification pretreatment at a temperature of 800-900 ℃ and a pressure of 5 MPa for 10-50 min.Experiments demonstrate that HCPEB modification facili-tates the dissolution of W and Cu,resulting in the forma-tion of a Cu0.4W0.6 solid solution and thus enhancing the uniform distribution of microstructures.Additionally,HCPEB-induced defects play a beneficial role in promoting the diffusion process by providing fast diffusion paths for elements.The optimal joints with the maximum shear strength of 213.7 MPa were obtained through bonding M-Cu and M-CuW at 900 ℃ and 5 MPa for 30 min,which attributes to the combined effects of fine-grained strengthening and solid solution strengthening.Overall,the application of HCPEB modification showcases its effec-tiveness in promoting element diffusion and enhancing the mechanical performance of the joints.
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NSTL
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