Process Validation and Cure Kinetics of Foam Adhesive for Composite Bonding
The curing process and cure kinetics of a moderate-temperature-curing adhesive foam had been investigated by dynamic differential scanning calorimetry(DSC)experiments.To confirm a linear relationship between the peak temperatures(Tp)of DSC curves and the natural logarithm of heating rates(β),in addition to the combination of heating rates β of 5,10,15 and 20 K/minin DSC tests,heating rates β of 1,2.718,7.389 and 20 K/min were designedly set,so that lnβ would be equal and approximate to 0,1,2 and 3 for easy calculation,thus curing parameters and the apparent activation energy(Ea)could be easily and quickly determined.Empirical linear relationships between Tp with lnβ had been sustained by a series of literature data about heating cure,thermal decomposition and crystallization of some polymers.Using the characteristic temperature parameters T1 and ΔT obtained from the above linear relationship,the magnitude of the activation energy(Ea)could be explained and the kinetic data could be quickly solved.The results have established and proved a simple and reliable kinetic solution other than methods by Kissinger and Ozawa.The simple method for solving the kinetic parameters of thermal-induced reaction or crystallization change is reasonable and effective.
Adhesive foamCuring processApparent activation energyTp-lnβ extrapolation methodMethod of mathematical limit
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