首页|不同SiC颗粒本构模型在SiCp/Al复合材料切削仿真中的应用

不同SiC颗粒本构模型在SiCp/Al复合材料切削仿真中的应用

扫码查看
基于有限元仿真软件建立SiC颗粒为JH2本构模型的SiCp/Al复合材料切削模型,并与前人的切削试验进行了对比,研究不同SiC颗粒本构模型的变化规律以及其切屑、表面形貌和切削力.结果表明,切削JH2模型SiC颗粒的SiCp/Al复合材料所产生的切屑较为破碎,材料表面不同位置的颗粒更接近实际切削实验中会出现挤出、碎断和凸起的情况,整体切削力波动较为平缓.JH2本构模型的SiC颗粒适用于SiCp/Al复合材料切削仿真.
Application of Different SiC Particle Constitutive Models in Cutting Simulation of SiCp/Al Composites
A cutting model for SiCp/Al composite material with SiC particles as JH2 constitutive model was established based on finite element simulation software,and was compared with previous cutting experiments.The research studied the trends associated with various SiC particle constitutive models,as well as the chip,surface morphology,and cutting force.The results show that the chips produced when cutting the SiC particles usin the JH2 model in SiCp/Al composite material are more fragmented,and the particles at different positions on the material surface are closer to the actual cutting experiment,where there are extrusion,fracture,and protrusion.The overall cutting force fluctuates more gently.It is concluded that the JH2 constitutive model of SiC particles is suitable for cutting simulation of SiC/Al composite material.

SiCp/Al compositesSiC particlesConstitutive modelFinite element simulation

林洁琼、孟繁昊、卢明明、杜永盛、高强

展开 >

长春工业大学机电工程学院,长春 130012

SiCp/Al复合材料 SiC颗粒 本构模型 有限元仿真

2024

宇航材料工艺
航天材料及工艺研究所

宇航材料工艺

CSTPCD北大核心
影响因子:0.378
ISSN:1007-2330
年,卷(期):2024.54(6)