X射线光电子能谱技术在无铅焊料中的应用
Application of X-ray photoelectron spectroscopy in lead-free solders
宋世杰 1张磊 1唐梦奇 2乐韵琳 1杨文超1
作者信息
- 1. 省部共建特色金属材料与组合结构全寿命安全国家重点实验室,有色金属及材料加工新技术教育部重点实验室,广西大学资源环境与材料学院,广西南宁 530004
- 2. 南宁海关技术中心,广西南宁 530000
- 折叠
摘要
先进的表面表征技术在无铅焊料的研究中发挥着至关重要的作用.作为一种具有高分辨率、高灵敏度的表面分析方法,X射线光电子能谱(X-ray photoelectron spectroscopy,XPS)可以对元素种类及化学价态等信息进行精准分析.文章主要介绍了 XPS在无铅焊料的组分及其氧化、润湿、腐蚀、电迁移等性能方面的应用,并多角度阐述了无铅焊料及焊点性能的影响机理,致力于为日后XPS在无铅焊料中的研究工作提供一些帮助.
Abstract
Advanced surface characterization techniques play a crucial role in the investigation of lead-free solders.As a surface analysis method with high resolution and sensitivity,X-ray photoelectron spectrosco-py(XPS)can accurately analyze the element type and valence states.In this paper,the application of XPS in analysis of chemical composition,oxidation,wetting,corrosion,electromigration and other properties of lead-free solders was mainly introduced.The influencing mechanisms of lead-free solders and solder joint properties were comprehensively discussed from multiple perspectives,which could provide some ref-erences for the studies of lead-free solders by XPS in future.
关键词
无铅焊料/X射线光电子能谱(XPS)/氧化机理/润湿机理/腐蚀机理/电迁移Key words
lead-free solder/X-ray photoelectron spectroscopy(XPS)/oxidation mechanism/wetting mechanism/corrosion mechanism/electromigration引用本文复制引用
基金项目
广西高等教育本科教学改革工程项目(2022JGB107)
广西自然科学基金(2020GXNSFBA297062)
出版年
2024