首页|改性硅溶胶封孔剂对多孔Al2O3陶瓷绝缘性能和微观结构的影响

改性硅溶胶封孔剂对多孔Al2O3陶瓷绝缘性能和微观结构的影响

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采用甲基三甲氧基硅烷和二甲基二甲氧基硅烷对硅溶胶进行改性制得有机硅改性硅溶胶封孔剂,并通过浸渍和加热固化的方法对多孔Al2O3陶瓷片进行封孔处理.研究了固化温度和固化时间对封孔Al2O3陶瓷片绝缘性能的影响,并对多孔Al2O3陶瓷片封孔前后的微观结构进行了表征.结果表明,较佳封孔条件为固化温度120℃、固化时间60 min,此时封孔Al2O3陶瓷片的直流和交流击穿电压分别达到最大值10.76 kV和6.01 kV,1 000 V绝缘电阻不低于9 999 MΩ.封孔Al2O3陶瓷片表面为改性硅溶胶涂层,呈致密无孔隙状态且与基体结合紧密,涂层厚度约为25 μm,表面水接触角提高到86.93°,封孔层深度约为 10 μm.
Effect of Modified Silica Sol Sealing Agent on the Insulation Properties and Microstructure of Porous Al2O3 Ceramics
The organosilicon modified silica sol sealant was prepared by modifying silica sol with methyltrimethoxysilane and dimethyldimethoxysilane,and the porous Al2O3 ceramic sheets were sealed by impregnation and heating curing.The effects of curing temperature and time on the insulation properties of porous Al2O3 ceramics sheets were studied,and the microstructure of porous Al2O3 ceramic sheets before and after sealing was characterized.The results show that the optimal conditions are that cu-ring temperature of 120 ℃ and curing time of 60 min,at which the DC and AC breakdown voltage of the Al2O3 ceramic sheets reach the maximum values of 10.76 kV and 6.01 kV respectively,and the insulation resistance of 1,000 V reaches more than 9,999 MΩ.The surface of the Al2O3 ceramic sheet is a modified silica sol coating,which is compact,non-porous and tightly bound to the matrix.The coating thickness is about 25 mm,the surface water contact angle is increased to 86.93°,and the depth of the layer is about 10 μm.

organosiliconsilica solporous Al2O3sealing agentinsulation

黎春阳、唐虎娇、郑文杰、张俊计、李国军

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大连交通大学环境与化学工程学院,辽宁大连 116028

瓦房店轴承集团国家轴承工程技术研究中心有限公司,辽宁大连 116300

大连交通大学材料科学与工程学院,辽宁大连 116028

有机硅 硅溶胶 多孔Al2O3 封孔剂 绝缘性

国家重点研发计划大连市揭榜挂帅科技公关项目

2020YFB20078032021JB12GX014

2024

有机硅材料
中国氟硅有机材料工业协会 中蓝晨光化工研究设计院有限公司 国家有机硅工程技术研究中心

有机硅材料

CSTPCD
影响因子:0.778
ISSN:1009-4369
年,卷(期):2024.38(1)
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