Preparation and Properties of Silicone/Modified Hollow Glass Microsphere Composites
Thermal insulation silicone/modified hollow glass microsphere composites with different contents of hollow glass microsphere were prepared by physical composition with condensed silicone as organic resin matrix and modified hollow glass beads as inorganic fillers.The thermal insulation mechanism and performance,mechanical properties and thermal stability of the thermal insulation material are studied,to achieve precise control of the porosity and thermal insulation performance of the com-posites.The results show that the compressive strength of the composites reaches a maximum of 13.28 MPa,which is 1.49 times that of pure silicone materials,and the lowest thermal conductivity is 0.113 W/(m·K),which is 37.91%lower than that of pure silicone materials.
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