有机硅/改性空心玻璃微珠复合材料的制备与性能研究
Preparation and Properties of Silicone/Modified Hollow Glass Microsphere Composites
汪曼秋 1肖卫强 2汪华文 2张庆华 1任勇源1
作者信息
- 1. 浙江大学化学工程与生物工程学院, 杭州 310027
- 2. 浙江中烟工业有限责任公司, 杭州 310024
- 折叠
摘要
以缩合型有机硅为有机树脂基体,以改性空心玻璃微珠为无机填料,基于物理复合法制备出不同空心玻璃微珠含量的有机硅/改性空心玻璃微珠复合隔热材料.系统性研究其隔热机理、隔热性能、力学性能和热稳定性能,实现对复合隔热材料孔隙率和隔热性能的精准调控.研究结果表明,所制得的复合隔热材料的压缩强度最大值达到13.28 MPa,是纯有机硅材料的1.49 倍,热导率最低为0.113 W/(m·K),比纯有机硅材料减小了37.91%.
Abstract
Thermal insulation silicone/modified hollow glass microsphere composites with different contents of hollow glass microsphere were prepared by physical composition with condensed silicone as organic resin matrix and modified hollow glass beads as inorganic fillers.The thermal insulation mechanism and performance,mechanical properties and thermal stability of the thermal insulation material are studied,to achieve precise control of the porosity and thermal insulation performance of the com-posites.The results show that the compressive strength of the composites reaches a maximum of 13.28 MPa,which is 1.49 times that of pure silicone materials,and the lowest thermal conductivity is 0.113 W/(m·K),which is 37.91%lower than that of pure silicone materials.
关键词
空心玻璃微珠/有机硅/隔热/热导率Key words
hollow glass bead/silicone/heat insulation/thermal conductivity引用本文复制引用
基金项目
浙江大学衢州研究院科技计划项目(IZQ2021KJ2009)
出版年
2024
NETL
NSTL
万方数据