低介电高导热垫片的制备
Preparation of Low Dielectric and High Thermal Conductivity Pad
戴如勇 1陆兰硕 2潘泰康 1李永波1
作者信息
- 1. 惠州美信电子有限公司, 广东惠州 516199
- 2. 美信新材料股份有限公司, 广东深圳 518053
- 折叠
摘要
以单端乙烯基硅油、侧链含氢硅油以及端含氢硅油等为基础胶料,添加中空球形六方氮化硼和氢氧化铝等导热粉体,制得低介电高导热垫片.探讨了中空球形六方氮化硼和氢氧化铝的用量、乙烯基硅油的种类及黏度、导热粉体处理剂的用量及中空球形六方氮化硼的加料工艺对导热垫片性能的影响.结果表明,制得的导热垫片热导率为3.09 W/(m·K),介电常数3.17,表面粘性良好,能满足高导热低介电导热界面材料的性能要求.
Abstract
A low dielectric and high thermal conductivity pad was prepared by adding hollow spherical hexagonal boron ni-tride and aluminum hydroxide thermal conductive powders based on single end vinyl silicone oil,side chain hydrogen containing silicone oil,and end hydrogen containing silicone oil.Effects of the dosage of hollow spherical hexagonal boron nitride and alumi-num hydroxide,the type and viscosity of vinyl silicone oil,the dosage of thermal conductive powder treatment agent,and the feeding process of hollow spherical hexagonal boron nitride on the performance of thermal conductive pad were explored.The re-sults show that the prepared thermal conductive pad has the thermal conductivity of 3.09 W/(m·K),the dielectric constant of 3.17,and good surface viscosity,which can meet the requirements of high thermal conductivity and low dielectric thermal con-ductivity interface materials.
关键词
垫片/低介电/六方氮化硼/导热Key words
pad/low dielectric/hexagonal boron nitride/heat conductive引用本文复制引用
出版年
2024
NETL
NSTL
万方数据