Preparation of Low Dielectric and High Thermal Conductivity Pad
A low dielectric and high thermal conductivity pad was prepared by adding hollow spherical hexagonal boron ni-tride and aluminum hydroxide thermal conductive powders based on single end vinyl silicone oil,side chain hydrogen containing silicone oil,and end hydrogen containing silicone oil.Effects of the dosage of hollow spherical hexagonal boron nitride and alumi-num hydroxide,the type and viscosity of vinyl silicone oil,the dosage of thermal conductive powder treatment agent,and the feeding process of hollow spherical hexagonal boron nitride on the performance of thermal conductive pad were explored.The re-sults show that the prepared thermal conductive pad has the thermal conductivity of 3.09 W/(m·K),the dielectric constant of 3.17,and good surface viscosity,which can meet the requirements of high thermal conductivity and low dielectric thermal con-ductivity interface materials.
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